LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC

LG Innotek (CEO Moon Hyuksoo) announced on May 27 that it will participate in the 2026 Electronic Components and Technology ...
Business Wire

Spirit Electronics Adds Automated BGA Reballing Service for Solder Ball Exchange

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...
Electronic Design

BGA Socket Ensures No Performance Loss

Supporting 27 mm x 27 mm, 1-mm pitch BGA packages on any PCB without significant performance loss, the SG-BGA-6346 operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. The ...
Electronic Design

SMT/BGA Rework System Incorporates FIR Technology

The company’s latest system incorporating the Focused Infra-Red (FIR) rework system technology replaces its Lightmaster model. Hands free and semi-automatic, the IR-X400 FIR rework system boasts the ...
Semiconductor Engineering

Establishing Connectivity Between Die and BGA

The BGA component serves the primary role of redistributing the signals from the die it protects to an interface pattern (the BGA’s balls) compatible with the host PCB it mounts on. As a result, many ...
talkandroid.com

Best BGA Rework Stations for Mobile Phone Repair: Usage and Tips

Editorial Note: Talk Android may contain affiliate links on some articles. If you make a purchase through these links, we will earn a commission at no extra cost to you. Learn more. Mobile phone ...
AZOM

Types of Semiconductor Packaging and Their Properties

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...