Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

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A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

As the complexity of automotive chips grows, so does the complexity of the package. In fact, packaging is becoming increasingly crucial to the performance and reliability of the chips, and both parts ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

SK Hynix Inc. is preparing a major capacity push as the global race to build AI-ready data centres strains the memory supply chain. The South Korean chipmaker plans to invest 19 trillion won ($12.9 ...

The US should invest more in cutting-edge semiconductor packaging to ensure it leads in emerging technologies such as artificial intelligence, Cadence Design Systems Inc. Chief Executive Officer ...

The US Department of Commerce has partnered with Infinera through the CHIPS and Science Act, signing a non-binding memorandum to provide up to US$93 million in funding. This investment aims to boost ...