Lam Research BESI Talks Highlight Push Into Advanced Packaging Content

Lam Research (NasdaqGS:LRCX) has reportedly held takeover talks with BE Semiconductor Industries (BESI). The discussions ...
newscase

ASML’s Strategic Pivot into Chip Packaging Draws Investor Scrutiny

The Dutch semiconductor equipment giant ASML is charting a new course, aiming to expand beyond its core lithography business ...
The National Interest

Beyond Moore’s Law: China’s Resilience and the Next Fronts in the Chip War

US export controls keep China behind in the chip war, yet advanced packaging and post–Moore’s Law innovations offer new paths forward. But what does it mean to be ahead or behind in semiconductors? To ...
Morningstar

Strong Momentum expected for Data Center AI Chip Packaging in 2025-2030

According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...