Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...

AI has become a key driver for the semiconductor industry as it is applied to ever more aspects of daily life. Many startups and established vendors are designing AI chips to accelerate algorithms and ...

This TechXchange examines chip packaging technology including new advances such as chiplets. Check out the video series on chip packaging. We’ve come a very long way from the first IC, but we still ...

Achieving the circuit densities we need for the next generation of electronics demands advanced packaging and chip-scale interconnect solutions. The need to look for alternative packaging solutions to ...

Applied Materials (NasdaqGS:AMAT) is acquiring ASMPT's NEXX business, adding advanced panel level packaging tools to its ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method, and the world's leading pure-play foundry has reportedly ...