Copper surge squeezes Korea PCB profits, firms pivot toward glass substrates Korean pcb makers face margin squeeze from copper rally, accelerating shift to glass substrates ...
Semiconductor manufacturing: Next-generation polyamide sheet shortens processing time and cuts costs
This company has developed a negative photo-definable polyimide sheet for glass-core substrates in used to connect chips to ...
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US scientists discover new 2D material that could be used in electrochemical energy tech
A team of Scientists almost a decade ago predicted that boron atoms would cling too tightly to copper to form borophene, a flexible, metallic two-dimensional material with potential across electronics ...
Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...
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