LEMSYS SA announced that it has upgraded a major IGBT and MOSFET production facility in China with a fully automated test line for high voltage Direct Bond Copper (DBC) substrates. LEMSYS SA announced ...
Ixys Corp. today said it has been granted a U.S. patent for its invention of a high-performance isolated power semiconductor assembly technology. U.S. Patent No. 6,404,065, concerns a novel isolated ...
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