The tool aims to ease the challenges of designing intricate 3D interconnects, offering engineers a way to handle multi-die ...

The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages ...

Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity ...

Surge in Digital Transformation Drives Demand for High-Speed Data Center Interconnects; Enterprises Embrace 400G/800G Optical Solutions for Low-Latency and Secure Transfers Amid AI and Hybrid Cloud ...

Based on TrendForce’s projection that nearly 4 million Google TPUs will be shipped in 2026, demand for 800G-plus optical modules is expected to exceed 6 million units ...

PLEASANTON, CA, UNITED STATES, February 10, 2026 /EINPresswire.com/ -- Inneos today announced Cheetah, a ruggedized ...

Ayar Labs Inc., a startup that’s developing optical interconnects that can transmit data between computer chips via light, said today it has closed on a hefty late-stage $155 million funding round led ...

The Bull brand, regrouping Atos Group’s Advanced Computing and AI activities, was officially launched on January 29, 2026, bringing back a historically rooted technology name. Bull is a global leader ...

One of the unsung workhorses of modern technology is the humble interconnect. This is essentially a wire or set of wires that link one part of an electronic system to another. In ordinary silicon ...

Smiths Interconnect’s high-power burn-in socket is a specialized electromechanical interface designed to temporarily connect a semiconductor device (like a CPU, GPU, AI accelerator or high-power ...