Equipment maker Lindner and Procter & Gamble say their solvent-based Flexloop process can remove impurities from recycled polymer chains. The secondary resins obtained through Flexloop not only comply ...

An ambitious, collaborative project of BASF, Krones, Südpack, and Tomra Recycling Sorting demonstrates that PET-based multilayer packaging can be delaminated and recycled on an industrial scale using ...

Mechanical Engineering Foundation Professor Miles Greiner accepted the 2022 W. Edwards Deming Outstanding Training Award in a virtual ceremony Oct. 27 on behalf of a program at the University. A ...

Thermal and mechanical packaging--the enabling technologies for the physical implementation of electronic systems--are responsible for much of the progress in miniaturization, reliability, and ...

Better performance and lower cost are always key trends being pursued in the semiconductor industry. Moore’s law has provided a very well-defined relationship between performance and cost and the ...

Henkel has released the 'first' cold seal solution designed for barrier-coated paper packaging, Loctite Liofol CS 7106 RE, ...

A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations” was ...

To this end, the trend in packagingmachinery design has been to increase the operational range of the machine by adding changeover flexibility for a wider range of tooling, variation in materials, and ...

Have you ever wondered how to eliminate internal delamination inside your semiconductor package, or how to reduce warpage of your large ball-grid array (BGA) package to eliminate non-wets during board ...