Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
Fairchild Semiconductor's FDMF6700 is an optimized and integrated FET-plus-driver power stage in a 6-mm x 6-mm MLP package. Fairchild Semiconductor’s FDMF6700 is an optimized and integrated ...
Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...
Raytheon has just announced a new $20 million contract through its Strategic and Spectrum Missions Advanced Resilient Trusted Systems (SSMARTS) consortium to develop a next-gen, multi-chip package ...
iCometrue received enthusiastic responses following its show at SEMICON TAIWAN 2023. Some companies have expressed great interest in iCometrue's Logic Drive and Field Programmable Multi-Chip Package ...
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First India-made chip module sent to US firm AOS
India’s first commercially packaged multi-chip module (MCM) was rolled out of Kaynes Semicon’s outsourced semiconductor assembly and test (OSAT) facility in Sanand in the wee hours of Wednesday and ...
Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...
MEMS are primarily transducer systems that can control or sense chemical, optical, or physical quantities, such as fluids, acceleration, or radiation. A MEMS device/transducer possesses an electrical ...
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