Nvidia has been working on a prototype multi-die AI accelerator chip called RC 18. The 36-module strong chip, developed by Nvidia Research, is currently being evaluated in the labs, and its highly ...
In designing multi-die systems-in-package, with or without chiplets, it is easy to think of the interconnect between dies as simply analogous to the interconnect between functional blocks on a single ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
AUSTIN, Texas – July 9, 2007 – Staktek Holdings, Inc. [NASDAQ: STAK], a market-leading provider of intellectual property and services for next-generation module technologies, today announced a new ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback