PCB and IC substrate makers are bracing for a challenging 2023 but expect demand for AI servers to drive their sales growth later this year, according to industry sources. Save my User ID and Password ...

Our appetite for new gadgets is resulting in a huge e-waste problem, with just a fraction of the 50 million tonnes of tech thrown away each year being recycled. Looking to tackle a significant part of ...

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will ...

E-waste is one of the main unfortunate consequences of the widespread adoption of electronic devices, and there are various efforts to stem the flow of this pernicious trash. One new approach from ...

The entire power-electronic sector, including RF applications and systems involving high-speed signals, is evolving toward solutions that offer increasingly complex functionalities in ever-smaller ...

FR4 is FR4, right? For a lot of PCB designs, the answer is yes — the particular characteristics of the substrate material don’t impact your design in any major way. But things get a little weird up in ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.