Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...
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System integration capability is increasingly needed in packaging HPC chips for AI, networking and other applications that accelerate digital transformation at enterprises and people's daily life, and ...
The US Department of Commerce has partnered with Infinera through the CHIPS and Science Act, signing a non-binding memorandum to provide up to US$93 million in funding. This investment aims to boost ...
Cleantech Group’s latest research highlights how innovation in advanced chip packaging is revolutionizing the semiconductor industry, offering massive energy savings, faster performance, and ...
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