Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing.

Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's advanced ...

TAIPEI/HONG KONG (Reuters) - Chinese state-backed technology conglomerate Tsinghua Unigroup Ltd is buying a 25 percent stake in Powertech Technology Inc for $600 million, becoming the largest ...

The investment arm of chip maker Intel Corp. said today that it agreed to invest $65 million (U.S.) in Powertech Technology Inc., a Taiwanese chip assembler that specializes in flash memory and ...

Benefiting from a tariff buffer period, customers actively stocked up in advance. Powertech Technology Inc. (PTI)'s invested testing and packaging subsidiary, Greatek Electronics, reported ...

The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. Nordson’s industry-leading ASYMTEK Vantage® Series fluid ...

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing.