The announced release of SPB 16.2, due in November of this year, from Cadence Design Systems, contains additions focused on addressing current and emerging chip package design challenges. This latest ...

TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...

Global System-in-Package (SiP) Technology Market to Reach US$34 Billion by the Year 2027. Amid the COVID-19 crisis, the global market for System-in-Package (SiP) Technology estimated at US$21. 4 ...

This product is featured in EDN's Hot 100 products of 2016. See all 100 here. Editor's note: I absolutely love new and innovative analog products, especially when they enhance functionality, ...

A system in package, or SiP, is a way of bundling two or more ICs inside a single package. This is in contrast to a system on chip, or SoC, where the functions on those chips are integrated onto the ...

The system-on-chip (SoC) is arguably the biggest misnomer of today’s electronics industry. The core integrated circuit may well have onboard much of the logic circuitry needed to support the needs of ...

The market for system-in-package (SiP) substrates is already tight and will become tighter as Apple is looking to adopt SiP technology in more of its AirPods series, according to sources at ...

Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

Infineon Technologies has announced the launch of its CoolSET System in Package (SiP). CoolSET System in Package (SiP) Credit: Infineon A compact, fully integrated system power controller for highly ...