Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

Companies to collaborate on the development of a 12-nanometer process platform targeting high-growth markets. Collaboration builds on Intel’s commitment to partnering with innovative companies in ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

The production of this new technology is scheduled to commence in 2027 at Intel’s Ocotillo Technology Fabrication facility located in Arizona. This strategic location will allow the partnership to ...

KLA Instruments™, a division of KLA Corporation, has expanded its defect inspection and metrology portfolio in 2023 to include new systems for semiconductor process development and control, including ...

The HPA07 high-performance CMOS semiconductor process from Texas Instruments will foster development of advanced analog chips, including analog-to-digital and digital-to-analog converters, op amps, ...

Intel Foundry Services (IFS) and leading semiconductor IP vendor Arm have jointly announced a design technology co-optimization (DTCO) agreement to develop multiple generations of Arm-based processor ...

Electronic devices have become an indispensable part of our lives in our technology-driven world. These devices owe their existence to a crucial component known as the semiconductor wafer. In this ...