FPT Group on Wednesday announced the establishment of its Advanced Semiconductor Testing and Packaging Plant, making it the ...
ST. PAUL, Minn., Sept. 30, 2025 /PRNewswire/ -- 3M has joined the next-generation semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, ...
Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...
FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant ...
MINNEAPOLIS--(BUSINESS WIRE)--CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new ...
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Advanced semiconductor testing and packaging plant to become operational in 2027
On January 28, the ceremony of announcing the establishment of the advanced semiconductor testing and packaging plant was held with the participation of Deputy Minister of Science and Technology Bui ...
The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...
FPT officially enters the chip race with Vietnam’s first advanced semiconductor packaging and testing plant, following ...
Thanks to capital expenditures in both the semiconductor and packaging industries, combined with growth in Asia, the general motion control (GMC) outlook is fairly rosy, according to the General ...
FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing & Packaging Plant.
The establishment of the advanced semiconductor chip testing and packaging factory demonstrates FPT’s commitment to ...
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