Parallel test is used for nearly every device produced by fabs and OSATs, but it can reduce yield and increase the cost of test boards and operations. This is a well-understood tradeoff for ensuring ...

Test facilities are beginning to implement real-time maintenance, rather than scheduled maintenance, to reduce manufacturing costs and boost product yield. Adaptive cleaning of probe needles and test ...

A new paradigm for semiconductor manufacturing test is coming. Unfortunately, it’s not yet completely defined, and most manufacturers still retain the traditional split between so-called front-end and ...

For leading-edge devices such as RF ICs, increasing frequency, package density, and thermal issues offer significant challenges to designing effective socket and load-board solutions for test.

As the AI boom drives demand for advanced packaging, chip testing at the backend is facing challenges in temperature, frequency, and speed. In response, the testing interface industry has been pushed ...