Fairchild Semiconductor (NYSE: FCS) has introduced the FAN7710, the most highly integrated ballast IC on the market specifically developed for compact fluorescent lamp (CFL) designs. Offering a ...

The latest system-on-a-chip (SOC) and system-in-a-package (SIP) devices combine microelectromechanical systems, optoelectronic components, sensors, and traditional circuits in a single package.

System-in-a-package (SiP) technology constitutes an enormous potential market, according to most market research firms. For example, Semico Research Corp. predicts that the revenue for SiP contract ...

ASE Technology has cut into the medical care industry supply chain with its system in a package (SiP) packaging for ultra-wideband (UWB) modules, according to industry sources. Save my User ID and ...