Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, ...

Chiplets are like smaller, specialized chips that can be combined to create a bigger, more powerful system. Heterogeneous integration is the fancy term for putting these different chiplets together in ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

The Mod-Sort system is designed to be a modular solution for energy-efficient package handling in a range of operational settings. The Mod-Sort large-format system introduces a technical advancement ...

For the PDF version of this article, click here. Electro-hydraulic and electric power steering (EHPS and EPS) systems are demanding applications for automotive electronics. As vehicle curb weight ...