TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

The majority of the credit goes to the DRAM, and then comes the chip costs. The year 2026 will see a breakthrough into the ...

Industry experts are closely tracking the development of the Apple 2nm A20 Pro chipset, expected to launch in late 2026.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

Apple is rumored to release the iPhone 18 Pro Max in September 2026, introducing several exciting upgrades that could ...

The future of iPhones is getting more certain with improvements in its capabilities and performance with the latest report behind Apple's iPhone 18 as it will soon use TSMC's new 2-nanometer chipset ...

TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration called ...

Apple is rumored to embed an enhanced 2nm chip inside the iPhone 18 models, expected to launch in 2026. These iOS smartphones would feature 12GB of RAM, claims a new rumor. In a Weibo post, a “Phone ...

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