Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.
Embedded silicon capacitors, or ECAPs, aim to solve issues of power integrity from inside the processor’s package.
What is physical AI and how does it extend edge AI running on embedded hardware? Why hardware/software co-design is vital for engineers working with physical AI. Where physical AI is headed, from ...
Here’s a dirty little secret: developing embedded software and firmware just got more complex, costly, and time-consuming. The EU Cyber Resilience Act is coming in 2027, and it’s going to ...
RPTU University of Kaiserslautern-Landau researchers published “From RTL to Prompt Coding: Empowering the Next Generation of Chip Designers through LLMs.” Abstract “This paper presents an LLM-based ...
One of the most crucial components of modern digital systems, field programmable gate arrays (FPGAs) provide for flexibility, parallel processing, and hardware-level acceleration. FPGAs, in contrast ...
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