Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

This year will see the broad emergence of 22-nm semiconductor processes and the beginning of an era in chip design of performance scaling versus geometric scaling. At 22 nm, innovations such as ...

Dublin, Dec. 19, 2025 (GLOBE NEWSWIRE) -- The "Semiconductor Process Control Equipment Market - Global Forecast 2025-2030" has been added to ResearchAndMarkets.com's offering. In this dynamic sector, ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

Intel Foundry Services (IFS) and leading semiconductor IP vendor Arm have jointly announced a design technology co-optimization (DTCO) agreement to develop multiple generations of Arm-based processor ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Although not among the most advanced technologies, 28-nanometer chips still play a fundamental role due to their stability, ...

Electronic devices have become an indispensable part of our lives in our technology-driven world. These devices owe their existence to a crucial component known as the semiconductor wafer. In this ...