Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...
The AI on ARM portfolio marks a key milestone in the collaboration between Innodisk and Qualcomm. The efficient architecture of the Qualcomm Dragonwing™ SoCs delivers exceptional AI inference TOPS ...
The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform. TAIPEI, Jan. 6, 2026 /PRNewswire/ -- Innodisk, a leading global AI ...
The COM-HPC Mini modules in Congatec's conga-HPC/mIQ-X series are based on Qualcomm's Dragonwing IQ-X series processors. © Congatec Embedded module supplier Congatec ...
The NIA's probe into the Red Fort suicide bombing reveals a Jaish-e-Mohammed module was developing rockets and planning drone attacks similar to Hamas. Arrests have foiled these plots, with one ...
Sonnet has launched new Thunderbolt 5 PCIe enclosures for Mac, doubling data speeds and expanding options for high-performance workflows. Sonnet Technologies just launched options for ...
The latest collaboration between the U.S. Dept of Energy’s National Renewable Energy Laboratory (NREL) and perovskite-silicon tandem manufacturer CubicPV, based in Bedford, Massachusetts, has yielded ...
Several reports have claimed that the Xiaomi 16 series of flagship phones will debut by September end this year. The Xiaomi 14 and 15 series consist of three models, such as standard, Pro, and Ultra.
Tria Technologies, an Avnet company that specialises in embedded compute boards, has launched the Tria HMM-RLP module, featuring the COM-HPC Mini form factor. The HMM-RLP module delivers improved ...
OnePlus is gearing up to launch a compact model in its 13 series, with the OnePlus 13 Mini reportedly arriving in March. Although the phone’s exact details have been subject to leaks, we now have a ...
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