TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Fresh leaks suggest the iPhone 18 Pro and iPhone 18 Pro Max could represent one of the most significant technological leaps in years.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration called ...

Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's strategic ...

Apple is expected to debut its next-generation 2nm A20 chipset in the iPhone 18 Pro lineup, promising faster performance, improved efficiency, and better thermals thanks to cutting-edge chip packaging ...

Apple’s upcoming A20 chip is rumored to be exclusive to the iPhone 18 Pro, Pro Max, and the company’s first foldable phone, marking a major performance leap with TSMC’s 2nm process. Base iPhone 18 ...

Apple's iPhone 18 Pro lineup is rumored to feature a new under-display area replacing the Dynamic Island and an advanced A20 ...